To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials

• المؤلف الرئيسي: Wan, Kai Tak
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: Research Report
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/7014
• المؤسسة: Nanyang Technological University

Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack pro...