To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials

• 主要作者: Wan, Kai Tak
• 其他作者: School of Mechanical and Aerospace Engineering
• 格式: Research Report
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• 在線閱讀: http://hdl.handle.net/10356/7014

Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack pro...