A new unified model for channel thermal noise of deep sub-micron RFCMOS
A new unified model for circuit simulation is presented to predict the high frequency channel thermal noise of deep sub-micron MOSFETs in strong inversion region. Based on the new channel thermal noise model, the simulated channel thermal noise spectral densities of the devices fabricated in a...
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Main Authors: | , , , , , , |
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Other Authors: | |
Format: | Conference or Workshop Item |
Language: | English |
Published: |
2010
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/79246 http://hdl.handle.net/10220/6349 |
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Institution: | Nanyang Technological University |
Language: | English |
Summary: | A new unified model for circuit simulation is
presented to predict the high frequency channel thermal
noise of deep sub-micron MOSFETs in strong inversion
region. Based on the new channel thermal noise model, the
simulated channel thermal noise spectral densities of the
devices fabricated in a 0.13μm RFCMOS technology process
are compared to the channel noise directly extracted from
RF noise measurements. |
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