Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

• Main Authors: He, Min, Chen, Zhong, Qi, Guojun, Wong, Chee C., Mhaisalkar, Subodh Gautam
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2012
• 主題: DRNTU::Engineering::Materials
• 在線閱讀: https://hdl.handle.net/10356/79508; http://hdl.handle.net/10220/8155
• 機構: Nanyang Technological University

Cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMC) formed between solder and its metallization. All these ultimately affect the mechanical integrity of the j...