Critical temperatures in thermocompression gold stud bonding

• Main Authors: Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2012
• 主題: DRNTU::Engineering::Materials
• 在線閱讀: https://hdl.handle.net/10356/90506; http://hdl.handle.net/10220/7735
• 機構: Nanyang Technological University

A study on temperature dependence in gold-gold (Au–Au) thermocompression bonding was performed. Gold studs were bonded to two kinds of surfaces—cofired gold on alumina and electroless nickel covered with immersion Au on silicon. A critical bonding temperature was...