Critical temperatures in thermocompression gold stud bonding
A study on temperature dependence in gold-gold (Au–Au) thermocompression bonding was performed. Gold studs were bonded to two kinds of surfaces—cofired gold on alumina and electroless nickel covered with immersion Au on silicon. A critical bonding temperature was...
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Main Authors: | Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J. |
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Other Authors: | School of Materials Science & Engineering |
Format: | Article |
Language: | English |
Published: |
2012
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/90506 http://hdl.handle.net/10220/7735 |
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Institution: | Nanyang Technological University |
Language: | English |
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