Critical temperatures in thermocompression gold stud bonding

• Main Authors: Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/90506; http://hdl.handle.net/10220/7735
• Institution: Nanyang Technological University

A study on temperature dependence in gold-gold (Au–Au) thermocompression bonding was performed. Gold studs were bonded to two kinds of surfaces—cofired gold on alumina and electroless nickel covered with immersion Au on silicon. A critical bonding temperature was...