Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel

We have fabricated silicon nanowire N-MOSFETs using erbium disilicide (ErSi2−x) in a Schottky source/drain back-gated architecture. Although the subthreshold swing (~180 mV/dec) and drain-induced barrier lowering (~500 mV/V) are high due thick BOX as gate oxide, the fabricated Schottky t...

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Main Authors: Cui, Guangda, Lee, Pooi See, Chi, Dong Zhi, Chin, Yoke King, Hoe, Keat Mun, Tan, Eu Jin, Pey, Kin Leong, Singh, Navab, Lo, Guo-Qiang
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/90576
http://hdl.handle.net/10220/8343
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-905762023-07-14T15:46:00Z Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel Cui, Guangda Lee, Pooi See Chi, Dong Zhi Chin, Yoke King Hoe, Keat Mun Tan, Eu Jin Pey, Kin Leong Singh, Navab Lo, Guo-Qiang School of Materials Science & Engineering DRNTU::Engineering::Materials We have fabricated silicon nanowire N-MOSFETs using erbium disilicide (ErSi2−x) in a Schottky source/drain back-gated architecture. Although the subthreshold swing (~180 mV/dec) and drain-induced barrier lowering (~500 mV/V) are high due thick BOX as gate oxide, the fabricated Schottky transistors show acceptable drive current ~900 μA/μm and high Ion/Ioff ratio (~105). This is attributed to the improved carrier injection as a result of low Schottky barrier height (Φb) of ErSi2−x/n − Si(~0.3 eV) and the nanometer-sized (~8 nm) Schottky junction. The carrier transport is found to be dominated by the metal–semiconductor interface instead of the channel body speculated from the channel length independent behavior of the devices. Furthermore, the transistors exhibit ambipolar characteristics, which are modeled using thermionic/ thermionic-field emission for positive and thermionic-field emission for negative gate biases. Accepted version 2012-07-26T03:51:17Z 2019-12-06T17:50:10Z 2012-07-26T03:51:17Z 2019-12-06T17:50:10Z 2008 2008 Journal Article Tan, E. J., Pey, K. L., Singh, N., Lo, G., Q., Chi, D. Z., Chin, Y. K., et al. (2008). Demonstration of Schottky Barrier NMOS Transistors with Erbium Silicided Source/drain and Silicon Nanowire Channel. IEEE Electron Device Letters, 29(10), 1167-1170. https://hdl.handle.net/10356/90576 http://hdl.handle.net/10220/8343 10.1109/LED.2008.2004508 en IEEE electron device letters © 2008 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: http://dx.doi.org/10.1109/LED.2008.2004508. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Cui, Guangda
Lee, Pooi See
Chi, Dong Zhi
Chin, Yoke King
Hoe, Keat Mun
Tan, Eu Jin
Pey, Kin Leong
Singh, Navab
Lo, Guo-Qiang
Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel
description We have fabricated silicon nanowire N-MOSFETs using erbium disilicide (ErSi2−x) in a Schottky source/drain back-gated architecture. Although the subthreshold swing (~180 mV/dec) and drain-induced barrier lowering (~500 mV/V) are high due thick BOX as gate oxide, the fabricated Schottky transistors show acceptable drive current ~900 μA/μm and high Ion/Ioff ratio (~105). This is attributed to the improved carrier injection as a result of low Schottky barrier height (Φb) of ErSi2−x/n − Si(~0.3 eV) and the nanometer-sized (~8 nm) Schottky junction. The carrier transport is found to be dominated by the metal–semiconductor interface instead of the channel body speculated from the channel length independent behavior of the devices. Furthermore, the transistors exhibit ambipolar characteristics, which are modeled using thermionic/ thermionic-field emission for positive and thermionic-field emission for negative gate biases.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Cui, Guangda
Lee, Pooi See
Chi, Dong Zhi
Chin, Yoke King
Hoe, Keat Mun
Tan, Eu Jin
Pey, Kin Leong
Singh, Navab
Lo, Guo-Qiang
format Article
author Cui, Guangda
Lee, Pooi See
Chi, Dong Zhi
Chin, Yoke King
Hoe, Keat Mun
Tan, Eu Jin
Pey, Kin Leong
Singh, Navab
Lo, Guo-Qiang
author_sort Cui, Guangda
title Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel
title_short Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel
title_full Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel
title_fullStr Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel
title_full_unstemmed Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel
title_sort demonstration of schottky barrier nmos transistors with erbium silicided source/drain and silicon nanowire channel
publishDate 2012
url https://hdl.handle.net/10356/90576
http://hdl.handle.net/10220/8343
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