Self-assembled monolayers for reduced temperature direct metal thermocompression bonding
A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a tempe...
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| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/90696 http://hdl.handle.net/10220/7708 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression
bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The
results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a temperature
as low as 160 °C. The temperature drop becomes more apparent when both coated and blank gold
samples are exposed in air over some time before bonding. The authors propose that self-assembled
monolayers passivate metal surface by obviating the adsorption of surface contaminants, in
particular, carbon and oxygen but get desorbed just before bonding takes place. |
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