Self-assembled monolayers for reduced temperature direct metal thermocompression bonding

• Main Authors: Ang, X. F., Li, F. Y., Tan, W. L., Chen, Z., Wong, Chee C., Wei, J.
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/90696; http://hdl.handle.net/10220/7708
• Institution: Nanyang Technological University

A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a tempe...