Self-assembled monolayers for reduced temperature direct metal thermocompression bonding
A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a tempe...
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sg-ntu-dr.10356-906962023-07-14T15:52:54Z Self-assembled monolayers for reduced temperature direct metal thermocompression bonding Ang, X. F. Li, F. Y. Tan, W. L. Chen, Z. Wong, Chee C. Wei, J. School of Materials Science & Engineering DRNTU::Engineering::Materials A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a temperature as low as 160 °C. The temperature drop becomes more apparent when both coated and blank gold samples are exposed in air over some time before bonding. The authors propose that self-assembled monolayers passivate metal surface by obviating the adsorption of surface contaminants, in particular, carbon and oxygen but get desorbed just before bonding takes place. Published version 2012-04-10T09:00:40Z 2019-12-06T17:52:21Z 2012-04-10T09:00:40Z 2019-12-06T17:52:21Z 2007 2007 Journal Article Ang, X. F., Li, F. Y., Tan, W. L., Chen, Z., Wong, C. C. & Wei, J. (2007). Self-assembled monolayers for reduced temperature direct metal thermocompression bonding. Applied Physics Letters, 91(6). https://hdl.handle.net/10356/90696 http://hdl.handle.net/10220/7708 10.1063/1.2768869 en Applied physics letters © 2007 American Institute of Physics. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following DOI: http://dx.doi.org/10.1063/1.2768869. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. 3 p. application/pdf |
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DRNTU::Engineering::Materials Ang, X. F. Li, F. Y. Tan, W. L. Chen, Z. Wong, Chee C. Wei, J. Self-assembled monolayers for reduced temperature direct metal thermocompression bonding |
| description |
A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression
bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The
results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a temperature
as low as 160 °C. The temperature drop becomes more apparent when both coated and blank gold
samples are exposed in air over some time before bonding. The authors propose that self-assembled
monolayers passivate metal surface by obviating the adsorption of surface contaminants, in
particular, carbon and oxygen but get desorbed just before bonding takes place. |
| author2 |
School of Materials Science & Engineering |
| author_facet |
School of Materials Science & Engineering Ang, X. F. Li, F. Y. Tan, W. L. Chen, Z. Wong, Chee C. Wei, J. |
| format |
Article |
| author |
Ang, X. F. Li, F. Y. Tan, W. L. Chen, Z. Wong, Chee C. Wei, J. |
| author_sort |
Ang, X. F. |
| title |
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding |
| title_short |
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding |
| title_full |
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding |
| title_fullStr |
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding |
| title_full_unstemmed |
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding |
| title_sort |
self-assembled monolayers for reduced temperature direct metal thermocompression bonding |
| publishDate |
2012 |
| url |
https://hdl.handle.net/10356/90696 http://hdl.handle.net/10220/7708 |
| _version_ |
1772827840532709376 |