Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root...

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Main Authors: Tan, Cher Ming, Gan, Zhenghao
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2009
Subjects:
DRNTU::Engineering::Electrical and electronic engineering
Online Access:https://hdl.handle.net/10356/91130
http://hdl.handle.net/10220/5337
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-911302020-03-07T13:57:27Z Failure mechanisms of aluminum bondpad peeling during thermosonic bonding Tan, Cher Ming Gan, Zhenghao School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root cause is the effect of skidding force as a result of the constrained movement of the bonding tool as bonding is done on a chip assembled in a plastic casing. With a change in the bonding tool movement, the peeling phenomenon is completely eliminated. Published version 2009-07-28T08:20:55Z 2019-12-06T18:00:16Z 2009-07-28T08:20:55Z 2019-12-06T18:00:16Z 2003 2003 Journal Article Tan, C. M., & Gan, Z. (2003). Failure mechanisms of aluminum bondpad peeling during thermosonic bonding. IEEE Transactions on Device and Materials Reliability, 3(2), 44-50. 1530-4388 https://hdl.handle.net/10356/91130 http://hdl.handle.net/10220/5337 10.1109/TDMR.2003.814408 en IEEE transactions on device and materials reliability © 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. 7 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Tan, Cher Ming
Gan, Zhenghao
Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
description Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root cause is the effect of skidding force as a result of the constrained movement of the bonding tool as bonding is done on a chip assembled in a plastic casing. With a change in the bonding tool movement, the peeling phenomenon is completely eliminated.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Tan, Cher Ming
Gan, Zhenghao
format Article
author Tan, Cher Ming
Gan, Zhenghao
author_sort Tan, Cher Ming
title Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
title_short Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
title_full Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
title_fullStr Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
title_full_unstemmed Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
title_sort failure mechanisms of aluminum bondpad peeling during thermosonic bonding
publishDate 2009
url https://hdl.handle.net/10356/91130
http://hdl.handle.net/10220/5337
_version_ 1681040872828829696

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