Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

• Main Authors: Tan, Cher Ming, Gan, Zhenghao
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/91130; http://hdl.handle.net/10220/5337
• Institution: Nanyang Technological University

Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root...