A micromechanism study of thermosonic gold wire bonding on aluminium pad

• المؤلفون الرئيسيون: Xu, Hui, Liu, Changqing, Silberschmidt, Vadim V., Pramana, S. S., White, Timothy John, Chen, Z., Sivakumar, M., Acoff, V. L.
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94156; http://hdl.handle.net/10220/7694
• المؤسسة: Nanyang Technological University

A micromechanism of thermosonic gold wire bonding was elaborated by examining its interfacial characteristics as a result of the bonding process, including the fragmentation of the native aluminum oxide layer on Al pads, and formation of initial intermetallic compounds...