The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects

• Main Authors: Ang, Derrick, Wong, Chee C., Ramanujan, Raju V.
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: https://hdl.handle.net/10356/94246; http://hdl.handle.net/10220/7256
• Institution: Nanyang Technological University

In this study, numerical work using ANSYS and analytical work based on Eshelby models were performed to examine the effect of aspect ratio scaling on the hydrostatic stress in passivated metal interconnects. Aluminium and copper interconnects passivated with phosphosilicate glass (PSG) with aspect r...