The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects

• المؤلفون الرئيسيون: Ang, Derrick, Wong, Chee C., Ramanujan, Raju V.
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94246; http://hdl.handle.net/10220/7256
• المؤسسة: Nanyang Technological University

In this study, numerical work using ANSYS and analytical work based on Eshelby models were performed to examine the effect of aspect ratio scaling on the hydrostatic stress in passivated metal interconnects. Aluminium and copper interconnects passivated with phosphosilicate glass (PSG) with aspect r...