Interfacial reaction between Sn-rich solders and Ni-based metallization

• المؤلفون الرئيسيون: Kumar, A., Yeo, P. T., He, Min, Qi, Guojun, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94701; http://hdl.handle.net/10220/8149
• المؤسسة: Nanyang Technological University

Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metallization (electroless Ni–P and sputtered Ni) has been studied. The growth rates of the main intermetallic compound (IMC), Ni3Sn4, at different aging temperatures are obtained and the activation energy...