Interfacial reaction between Sn-rich solders and Ni-based metallization

• Main Authors: Kumar, A., Yeo, P. T., He, Min, Qi, Guojun, Chen, Zhong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/94701; http://hdl.handle.net/10220/8149
• Institution: Nanyang Technological University

Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metallization (electroless Ni–P and sputtered Ni) has been studied. The growth rates of the main intermetallic compound (IMC), Ni3Sn4, at different aging temperatures are obtained and the activation energy...