Interfacial reaction between Sn-rich solders and Ni-based metallization

Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metallization (electroless Ni–P and sputtered Ni) has been studied. The growth rates of the main intermetallic compound (IMC), Ni3Sn4, at different aging temperatures are obtained and the activation energy...

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Bibliographic Details
Main Authors: Kumar, A., Yeo, P. T., He, Min, Qi, Guojun, Chen, Zhong
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/94701
http://hdl.handle.net/10220/8149
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Institution: Nanyang Technological University
Language: English
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