Electroless copper seed layer deposition on tantalum nitride barrier film

• المؤلفون الرئيسيون: Chong, S. P., Law, S. B., Ee, Elden Yong Chiang, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94702; http://hdl.handle.net/10220/8157

Electroless (EL) deposition is used as a seeding technology for Cu metallization in the back-end-of-line semiconductor fabrication process. In this work, effect of deposition time and annealing treatment on the properties of electroless copper seed layer are reported. It is found that all seed layer...