Electroless copper seed layer deposition on tantalum nitride barrier film

• Main Authors: Chong, S. P., Law, S. B., Ee, Elden Yong Chiang, Chen, Zhong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Online Access: https://hdl.handle.net/10356/94702; http://hdl.handle.net/10220/8157
• Institution: Nanyang Technological University

Electroless (EL) deposition is used as a seeding technology for Cu metallization in the back-end-of-line semiconductor fabrication process. In this work, effect of deposition time and annealing treatment on the properties of electroless copper seed layer are reported. It is found that all seed layer...