Electroless copper seed layer deposition on tantalum nitride barrier film
Electroless (EL) deposition is used as a seeding technology for Cu metallization in the back-end-of-line semiconductor fabrication process. In this work, effect of deposition time and annealing treatment on the properties of electroless copper seed layer are reported. It is found that all seed layer...
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2012
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| Online Access: | https://hdl.handle.net/10356/94702 http://hdl.handle.net/10220/8157 |
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| Institution: | Nanyang Technological University |
| Language: | English |