Electroless copper seed layer deposition on tantalum nitride barrier film

• Main Authors: Chong, S. P., Law, S. B., Ee, Elden Yong Chiang, Chen, Zhong
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2012
• 在線閱讀: https://hdl.handle.net/10356/94702; http://hdl.handle.net/10220/8157

Electroless (EL) deposition is used as a seeding technology for Cu metallization in the back-end-of-line semiconductor fabrication process. In this work, effect of deposition time and annealing treatment on the properties of electroless copper seed layer are reported. It is found that all seed layer...