Pulse electroplating of copper film : a study of process and microstructure

• Main Authors: Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, Chee C., Mhaisalkar, Subodh Gautam, Li, X. M., Tung, Chih Hang, Cheng, C. K.
• 其他作者: School of Mechanical and Aerospace Engineering
• 格式: Article
• 語言: English
• 出版: 2012
• 在線閱讀: https://hdl.handle.net/10356/94840; http://hdl.handle.net/10220/8115

Copper films with high density of twin boundaries are known for high mechanical strength with little tradeoff in electrical conductivity. To achieve such a high density, twin lamellae and spacing will be on the nanoscale. In the current study, 10 microm copper films were prepared by pulse electrodep...