Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

An analytical model is proposed which relates the bonding temperature, pressure and duration with the integrity of metal–metal thermocompressionbonds. Unlike previous models, this approach takes into account the pressure-dependent time evolution of the thermocompressionbond formation. The model allo...

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Bibliographic Details
Main Authors: Made, Riko I., Thompson, Carl V., Gan, Chee Lip, Yan, Li Ling, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/96939
http://hdl.handle.net/10220/8174
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Institution: Nanyang Technological University
Language: English

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