Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations

• Main Authors: Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, Chen, Zhong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2013
• Online Access: https://hdl.handle.net/10356/97085; http://hdl.handle.net/10220/10436
• Institution: Nanyang Technological University

The effect of moderate electric current density (1 × 10^3 to 3 × 10^3 A/cm^2) on the mechanical properties of Ni-P/Sn-3.5Ag/Ni-P and Ni/Sn-3.5Ag/Ni solder joints was investigated using a microtensile test. Thermal aging was carried out at 160°C for 100 h while the current was passed. The interfacial...