Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints

This work investigates the effect of interfacial reaction on the mechanical strength of two types of solder joints, Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P. The tensile strength and fracture behavior of the joints under different thermal aging conditions have been studied. It is observed that the tensile str...

Full description

Saved in:
Bibliographic Details
Main Authors: Qi, Guojun, Chen, Z., He, M., Kumar, A.
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/97193
http://hdl.handle.net/10220/10437
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-97193
record_format dspace
spelling sg-ntu-dr.10356-971932020-06-01T10:01:52Z Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints Qi, Guojun Chen, Z. He, M. Kumar, A. School of Materials Science & Engineering A*STAR SIMTech This work investigates the effect of interfacial reaction on the mechanical strength of two types of solder joints, Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P. The tensile strength and fracture behavior of the joints under different thermal aging conditions have been studied. It is observed that the tensile strength decreases with increasing aging temperature and duration. Associated with the tensile strength decrease is the transition of failure modes from within the bulk solder in the as-soldered condition toward failures at the interface between the solder and the intermetallic compounds (IMCs). For the same aging treatment, the strength of the Sn-3.5Ag/Ni-P joint degrades faster than that of Sn-37Pb/Ni-P. The difference between the two types of joints can be explained by the difference in their interfacial reaction and growth kinetics. An empirical relation is established between the solder joint strength and the Ni3Sn4 intermetallic compound thickness. 2013-06-17T04:42:45Z 2019-12-06T19:40:05Z 2013-06-17T04:42:45Z 2019-12-06T19:40:05Z 2006 2006 Journal Article Chen, Z., He, M., Kumar, A., & Qi, G. J. (2007). Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints. Journal of Electronic Materials, 36(1), 17-25. 0361-5235 https://hdl.handle.net/10356/97193 http://hdl.handle.net/10220/10437 10.1007/s11664-006-0008-1 en Journal of electronic materials © 2006 TMS.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
description This work investigates the effect of interfacial reaction on the mechanical strength of two types of solder joints, Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P. The tensile strength and fracture behavior of the joints under different thermal aging conditions have been studied. It is observed that the tensile strength decreases with increasing aging temperature and duration. Associated with the tensile strength decrease is the transition of failure modes from within the bulk solder in the as-soldered condition toward failures at the interface between the solder and the intermetallic compounds (IMCs). For the same aging treatment, the strength of the Sn-3.5Ag/Ni-P joint degrades faster than that of Sn-37Pb/Ni-P. The difference between the two types of joints can be explained by the difference in their interfacial reaction and growth kinetics. An empirical relation is established between the solder joint strength and the Ni3Sn4 intermetallic compound thickness.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Qi, Guojun
Chen, Z.
He, M.
Kumar, A.
format Article
author Qi, Guojun
Chen, Z.
He, M.
Kumar, A.
spellingShingle Qi, Guojun
Chen, Z.
He, M.
Kumar, A.
Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints
author_sort Qi, Guojun
title Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints
title_short Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints
title_full Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints
title_fullStr Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints
title_full_unstemmed Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints
title_sort effect of interfacial reaction on the tensile strength of sn-3.5ag/ni-p and sn-37pb/ni-p solder joints
publishDate 2013
url https://hdl.handle.net/10356/97193
http://hdl.handle.net/10220/10437
_version_ 1681059650398584832