Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints
This work investigates the effect of interfacial reaction on the mechanical strength of two types of solder joints, Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P. The tensile strength and fracture behavior of the joints under different thermal aging conditions have been studied. It is observed that the tensile str...
Saved in:
Main Authors: | Qi, Guojun, Chen, Z., He, M., Kumar, A. |
---|---|
Other Authors: | School of Materials Science & Engineering |
Format: | Article |
Language: | English |
Published: |
2013
|
Online Access: | https://hdl.handle.net/10356/97193 http://hdl.handle.net/10220/10437 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
by: He, Min, et al.
Published: (2012) -
Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
by: He, Min, et al.
Published: (2012) -
Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint
by: Kumar, Aditya, et al.
Published: (2013) -
Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength
by: Aditya Kumar
Published: (2008) -
Fracture properties of Sn-37Pb and Sn-3.5Ag solder joints
by: Siow, Kim Shyong.
Published: (2008)