Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints

• Main Authors: Qi, Guojun, Chen, Z., He, M., Kumar, A.
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2013
• 在線閱讀: https://hdl.handle.net/10356/97193; http://hdl.handle.net/10220/10437

This work investigates the effect of interfacial reaction on the mechanical strength of two types of solder joints, Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P. The tensile strength and fracture behavior of the joints under different thermal aging conditions have been studied. It is observed that the tensile str...