Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization

• Main Authors: Tan, Chuan Seng, Lim, Dau Fatt, Peng, Lan, Li, Hong Yu
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Online Access: https://hdl.handle.net/10356/99123; http://hdl.handle.net/10220/12805
• Institution: Nanyang Technological University

Email Print Request Permissions In this invited paper, a non-UHV and non-corrosive method using self-assembled monolayer (SAM) to passivate Cu surface to prevent oxidation and contamination is investigated. The final goal is to enable low temperature Cu-Cu bonding for high...