Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope
International Journal of Microcircuits and Electronic Packaging
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2014
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sg-nus-scholar.10635-1129632015-01-14T18:05:56Z Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope Lu, J. Trigg, A. Wu, J. Chai, T. INSTITUTE OF MICROELECTRONICS International Journal of Microcircuits and Electronic Packaging 21 3 231-236 IMICD 2014-11-28T08:12:45Z 2014-11-28T08:12:45Z 1998-09 Article Lu, J.,Trigg, A.,Wu, J.,Chai, T. (1998-09). Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope. International Journal of Microcircuits and Electronic Packaging 21 (3) : 231-236. ScholarBank@NUS Repository. 10631674 http://scholarbank.nus.edu.sg/handle/10635/112963 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
International Journal of Microcircuits and Electronic Packaging |
| author2 |
INSTITUTE OF MICROELECTRONICS |
| author_facet |
INSTITUTE OF MICROELECTRONICS Lu, J. Trigg, A. Wu, J. Chai, T. |
| format |
Article |
| author |
Lu, J. Trigg, A. Wu, J. Chai, T. |
| spellingShingle |
Lu, J. Trigg, A. Wu, J. Chai, T. Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope |
| author_sort |
Lu, J. |
| title |
Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope |
| title_short |
Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope |
| title_full |
Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope |
| title_fullStr |
Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope |
| title_full_unstemmed |
Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope |
| title_sort |
detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/112963 |
| _version_ |
1681094578697928704 |