Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope
International Journal of Microcircuits and Electronic Packaging
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Main Authors: | Lu, J., Trigg, A., Wu, J., Chai, T. |
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Other Authors: | INSTITUTE OF MICROELECTRONICS |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/112963 |
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Institution: | National University of Singapore |
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