FIB precision TEM sample preparation using carbon replica

Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA

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書目詳細資料
Main Authors: Sheng, T.T., Goh, G.P., Tung, C.H., Wang, John L.F., Cheng, Jeng Kou
其他作者: INSTITUTE OF MICROELECTRONICS
格式: Conference or Workshop Item
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/112977
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機構: National University of Singapore
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總結:Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA