FIB precision TEM sample preparation using carbon replica
Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA
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2014
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sg-nus-scholar.10635-1129772015-02-01T03:30:38Z FIB precision TEM sample preparation using carbon replica Sheng, T.T. Goh, G.P. Tung, C.H. Wang, John L.F. Cheng, Jeng Kou INSTITUTE OF MICROELECTRONICS Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 92-96 234 2014-11-28T08:12:55Z 2014-11-28T08:12:55Z 1997 Conference Paper Sheng, T.T.,Goh, G.P.,Tung, C.H.,Wang, John L.F.,Cheng, Jeng Kou (1997). FIB precision TEM sample preparation using carbon replica. Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA : 92-96. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/112977 NOT_IN_WOS Scopus |
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Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA |
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INSTITUTE OF MICROELECTRONICS |
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INSTITUTE OF MICROELECTRONICS Sheng, T.T. Goh, G.P. Tung, C.H. Wang, John L.F. Cheng, Jeng Kou |
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Conference or Workshop Item |
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Sheng, T.T. Goh, G.P. Tung, C.H. Wang, John L.F. Cheng, Jeng Kou |
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Sheng, T.T. Goh, G.P. Tung, C.H. Wang, John L.F. Cheng, Jeng Kou FIB precision TEM sample preparation using carbon replica |
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Sheng, T.T. |
title |
FIB precision TEM sample preparation using carbon replica |
title_short |
FIB precision TEM sample preparation using carbon replica |
title_full |
FIB precision TEM sample preparation using carbon replica |
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FIB precision TEM sample preparation using carbon replica |
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FIB precision TEM sample preparation using carbon replica |
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fib precision tem sample preparation using carbon replica |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/112977 |
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