FIB precision TEM sample preparation using carbon replica

FIB precision TEM sample preparation using carbon replica

Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA

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Bibliographic Details
Main Authors: Sheng, T.T., Goh, G.P., Tung, C.H., Wang, John L.F., Cheng, Jeng Kou
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/112977
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/112977

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