Effect of crystallographic orientation on wear of diamond tools in nanoscale ductile cutting of silicon
Master's
Saved in:
Main Author: | MOHAMMAD SHARIF UDDIN |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2010
|
Subjects: | |
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/14344 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Language: | English |
Similar Items
-
Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon
by: Uddin, M.S., et al.
Published: (2014) -
Performance of single crystal diamond tools in ductile mode cutting of silicon
by: Uddin, M.S., et al.
Published: (2014) -
A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
by: Liu, K., et al.
Published: (2014) -
Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
by: Li, X.P., et al.
Published: (2014) -
Effect of crystalline orientation of a diamond tool on the machined surface in ductile mode cutting of silicon
by: Li, X.P., et al.
Published: (2014)