Modeling and characterization of abrasive-free copper chemical mechanical planarization process

Modeling and characterization of abrasive-free copper chemical mechanical planarization process

Master's

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書目詳細資料
主要作者:	TABASSUMUL HAQUE
其他作者:	MECHANICAL ENGINEERING
格式:	Theses and Dissertations
語言:	English
出版:	2010
主題:	Abrasive-free Copper CMP, Material Removal Mechanism, Material Removal Rate, Within Wafer Non-Uniformity, Non-Prestonian Phenomenon, Modes of Contact
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/14454
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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