Dielectric reliability of copper/low-k interconnects

Ph.D

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Bibliographic Details
Main Author:	YIANG KOK YONG
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Reliability, Low-k, Buried Capping Layer, BCL, TDDB, in-situ FTIRS
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/15133
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-15133
record_format	dspace
spelling	sg-nus-scholar.10635-151332017-10-21T09:54:38Z Dielectric reliability of copper/low-k interconnects YIANG KOK YONG ELECTRICAL & COMPUTER ENGINEERING YOO WON JONG Reliability, Low-k, Buried Capping Layer, BCL, TDDB, in-situ FTIRS Ph.D DOCTOR OF PHILOSOPHY 2010-04-08T10:50:22Z 2010-04-08T10:50:22Z 2006-03-07 Thesis YIANG KOK YONG (2006-03-07). Dielectric reliability of copper/low-k interconnects. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/15133 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Reliability, Low-k, Buried Capping Layer, BCL, TDDB, in-situ FTIRS
spellingShingle	Reliability, Low-k, Buried Capping Layer, BCL, TDDB, in-situ FTIRS YIANG KOK YONG Dielectric reliability of copper/low-k interconnects
description	Ph.D
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING YIANG KOK YONG
format	Theses and Dissertations
author	YIANG KOK YONG
author_sort	YIANG KOK YONG
title	Dielectric reliability of copper/low-k interconnects
title_short	Dielectric reliability of copper/low-k interconnects
title_full	Dielectric reliability of copper/low-k interconnects
title_fullStr	Dielectric reliability of copper/low-k interconnects
title_full_unstemmed	Dielectric reliability of copper/low-k interconnects
title_sort	dielectric reliability of copper/low-k interconnects
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/15133
_version_	1681079143470465024

Dielectric reliability of copper/low-k interconnects

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