3D printing of highly pure copper

10.3390/met9070756

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Bibliographic Details
Main Authors:	Tran, T.Q., Chinnappan, A., Lee, J.K.Y., Loc, N.H., Tran, L.T., Wang, G., Kumar, V.V., Jayathilaka, W.A.D.M., Ji, D., Doddamani, M., Ramakrishna, S.
Other Authors:	MECHANICAL ENGINEERING
Format:	Review
Published:	MDPI AG 2022
Subjects:	Additive manufacturing Binder jetting Copper Electron beam melting Selective laser melting Ultrasonic additive manufacturing
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/213259
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Institution:	National University of Singapore

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Summary:	10.3390/met9070756

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