3D printing of highly pure copper
10.3390/met9070756
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Main Authors: | Tran, T.Q., Chinnappan, A., Lee, J.K.Y., Loc, N.H., Tran, L.T., Wang, G., Kumar, V.V., Jayathilaka, W.A.D.M., Ji, D., Doddamani, M., Ramakrishna, S. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Review |
Published: |
MDPI AG
2022
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Subjects: | |
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/213259 |
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Institution: | National University of Singapore |
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