3D printing of highly pure copper

10.3390/met9070756

Saved in:

Bibliographic Details
Main Authors:	Tran, T.Q., Chinnappan, A., Lee, J.K.Y., Loc, N.H., Tran, L.T., Wang, G., Kumar, V.V., Jayathilaka, W.A.D.M., Ji, D., Doddamani, M., Ramakrishna, S.
Other Authors:	MECHANICAL ENGINEERING
Format:	Review
Published:	MDPI AG 2022
Subjects:	Additive manufacturing Binder jetting Copper Electron beam melting Selective laser melting Ultrasonic additive manufacturing
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/213259
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-213259
record_format	dspace
spelling	sg-nus-scholar.10635-2132592024-04-04T02:09:07Z 3D printing of highly pure copper Tran, T.Q. Chinnappan, A. Lee, J.K.Y. Loc, N.H. Tran, L.T. Wang, G. Kumar, V.V. Jayathilaka, W.A.D.M. Ji, D. Doddamani, M. Ramakrishna, S. MECHANICAL ENGINEERING Additive manufacturing Binder jetting Copper Electron beam melting Selective laser melting Ultrasonic additive manufacturing 10.3390/met9070756 Metals 9 7 756 2022-01-07T03:51:25Z 2022-01-07T03:51:25Z 2019 Review Tran, T.Q., Chinnappan, A., Lee, J.K.Y., Loc, N.H., Tran, L.T., Wang, G., Kumar, V.V., Jayathilaka, W.A.D.M., Ji, D., Doddamani, M., Ramakrishna, S. (2019). 3D printing of highly pure copper. Metals 9 (7) : 756. ScholarBank@NUS Repository. https://doi.org/10.3390/met9070756 2075-4701 https://scholarbank.nus.edu.sg/handle/10635/213259 Attribution 4.0 International https://creativecommons.org/licenses/by/4.0/ MDPI AG Scopus OA2019
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Additive manufacturing Binder jetting Copper Electron beam melting Selective laser melting Ultrasonic additive manufacturing
spellingShingle	Additive manufacturing Binder jetting Copper Electron beam melting Selective laser melting Ultrasonic additive manufacturing Tran, T.Q. Chinnappan, A. Lee, J.K.Y. Loc, N.H. Tran, L.T. Wang, G. Kumar, V.V. Jayathilaka, W.A.D.M. Ji, D. Doddamani, M. Ramakrishna, S. 3D printing of highly pure copper
description	10.3390/met9070756
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tran, T.Q. Chinnappan, A. Lee, J.K.Y. Loc, N.H. Tran, L.T. Wang, G. Kumar, V.V. Jayathilaka, W.A.D.M. Ji, D. Doddamani, M. Ramakrishna, S.
format	Review
author	Tran, T.Q. Chinnappan, A. Lee, J.K.Y. Loc, N.H. Tran, L.T. Wang, G. Kumar, V.V. Jayathilaka, W.A.D.M. Ji, D. Doddamani, M. Ramakrishna, S.
author_sort	Tran, T.Q.
title	3D printing of highly pure copper
title_short	3D printing of highly pure copper
title_full	3D printing of highly pure copper
title_fullStr	3D printing of highly pure copper
title_full_unstemmed	3D printing of highly pure copper
title_sort	3d printing of highly pure copper
publisher	MDPI AG
publishDate	2022
url	https://scholarbank.nus.edu.sg/handle/10635/213259
_version_	1800915299585753088

3D printing of highly pure copper

Similar Items