3D printing of highly pure copper

• Main Authors: Tran, T.Q., Chinnappan, A., Lee, J.K.Y., Loc, N.H., Tran, L.T., Wang, G., Kumar, V.V., Jayathilaka, W.A.D.M., Ji, D., Doddamani, M., Ramakrishna, S.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Review
• 出版: MDPI AG 2022
• 主題: Additive manufacturing; Binder jetting; Copper; Electron beam melting; Selective laser melting; Ultrasonic additive manufacturing
• 在線閱讀: https://scholarbank.nus.edu.sg/handle/10635/213259
• 機構: National University of Singapore

10.3390/met9070756