Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects

Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects

10.1021/acsaelm.3c00809

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Bibliographic Details
Main Authors: Salim El Kazzi, Ya Woon Lum, Ivan Erofeev, Saumitra Vajandar, Sergej Pasko, Simonas Krotkus, Ben Conran, Oliver Whear, Thomas Osipowicz, Utkur Mirziyodovich Mirsaidov
Other Authors: BIOLOGICAL SCIENCES
Format: Article
Language:English
Published: ACD Applied Electronic Materials 2024
Subjects:
2Dmaterials
interconnects
diffusion barriers
MOCVD
nanofabrication
Online Access:https://scholarbank.nus.edu.sg/handle/10635/248755
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Institution: National University of Singapore
Language: English
Description
Summary:10.1021/acsaelm.3c00809

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