Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects
10.1021/acsaelm.3c00809
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ACD Applied Electronic Materials
2024
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| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/248755 |
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sg-nus-scholar.10635-2487552024-11-13T00:09:09Z Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects Salim El Kazzi Ya Woon Lum Ivan Erofeev Saumitra Vajandar Sergej Pasko Simonas Krotkus Ben Conran Oliver Whear Thomas Osipowicz Utkur Mirziyodovich Mirsaidov BIOLOGICAL SCIENCES 2Dmaterials interconnects diffusion barriers MOCVD nanofabrication 10.1021/acsaelm.3c00809 2024-06-10T04:45:53Z 2024-06-10T04:45:53Z 2023-09-05 Article Salim El Kazzi, Ya Woon Lum, Ivan Erofeev, Saumitra Vajandar, Sergej Pasko, Simonas Krotkus, Ben Conran, Oliver Whear, Thomas Osipowicz, Utkur Mirziyodovich Mirsaidov (2023-09-05). Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects. ScholarBank@NUS Repository. https://doi.org/10.1021/acsaelm.3c00809 2637-6113 https://scholarbank.nus.edu.sg/handle/10635/248755 en Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/ ACD Applied Electronic Materials |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| language |
English |
| topic |
2Dmaterials interconnects diffusion barriers MOCVD nanofabrication |
| spellingShingle |
2Dmaterials interconnects diffusion barriers MOCVD nanofabrication Salim El Kazzi Ya Woon Lum Ivan Erofeev Saumitra Vajandar Sergej Pasko Simonas Krotkus Ben Conran Oliver Whear Thomas Osipowicz Utkur Mirziyodovich Mirsaidov Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects |
| description |
10.1021/acsaelm.3c00809 |
| author2 |
BIOLOGICAL SCIENCES |
| author_facet |
BIOLOGICAL SCIENCES Salim El Kazzi Ya Woon Lum Ivan Erofeev Saumitra Vajandar Sergej Pasko Simonas Krotkus Ben Conran Oliver Whear Thomas Osipowicz Utkur Mirziyodovich Mirsaidov |
| format |
Article |
| author |
Salim El Kazzi Ya Woon Lum Ivan Erofeev Saumitra Vajandar Sergej Pasko Simonas Krotkus Ben Conran Oliver Whear Thomas Osipowicz Utkur Mirziyodovich Mirsaidov |
| author_sort |
Salim El Kazzi |
| title |
Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects |
| title_short |
Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects |
| title_full |
Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects |
| title_fullStr |
Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects |
| title_full_unstemmed |
Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects |
| title_sort |
assessing ultrathin wafer-scale ws2 as a diffusion barrier for cu interconnects |
| publisher |
ACD Applied Electronic Materials |
| publishDate |
2024 |
| url |
https://scholarbank.nus.edu.sg/handle/10635/248755 |
| _version_ |
1821195743686295552 |