Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects
10.1021/acsaelm.3c00809
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| Main Authors: | , , , , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
ACD Applied Electronic Materials
2024
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| Subjects: | |
| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/248755 |
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| Institution: | National University of Singapore |
| Language: | English |