Formation of air gap structures for inter-metal dielectric application

US6251798

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Bibliographic Details
Main Authors: SOO, CHOI PHENG, TEE, KHENG CHOK, ONG, KOK KENG, CHAN, LAP
Other Authors: MATERIALS SCIENCE
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32593
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Institution: National University of Singapore
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