Planar microspring integrated circuit chip interconnection to next level

Planar microspring integrated circuit chip interconnection to next level

US20060197232A1

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Bibliographic Details
Main Authors: TAY, ANDREW AH ONG, ANG, SIMON SAW-TEONG, LIAO, EBIN
Other Authors: MECHANICAL ENGINEERING
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/35266
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/35266

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