Planar microspring integrated circuit chip interconnection to next level
US20060197232A1
Saved in:
Main Authors: | TAY, ANDREW AH ONG, ANG, SIMON SAW-TEONG, LIAO, EBIN |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Patent |
Published: |
2012
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/35266 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging
by: Liao, E.B., et al.
Published: (2014) -
Compliant Chip-to-Package Interconnects for Wafer Level Packaging
by: LIAO EBIN
Published: (2011) -
Plasmonic interconnects for global wires in integrated circuits
by: Soo-jin Chua, et al.
Published: (2020) -
Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects
by: Sharma, G., et al.
Published: (2014) -
Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
by: Liao, E.B., et al.
Published: (2014)