Planar microspring integrated circuit chip interconnection to next level

Planar microspring integrated circuit chip interconnection to next level

US20060197232A1

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Bibliographic Details
Main Authors: TAY, ANDREW AH ONG, ANG, SIMON SAW-TEONG, LIAO, EBIN
Other Authors: MECHANICAL ENGINEERING
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/35266
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Institution: National University of Singapore
id sg-nus-scholar.10635-35266
record_format dspace
spelling sg-nus-scholar.10635-352662024-11-14T00:35:57Z Planar microspring integrated circuit chip interconnection to next level TAY, ANDREW AH ONG ANG, SIMON SAW-TEONG LIAO, EBIN MECHANICAL ENGINEERING NATIONAL UNIVERSITY OF SINGAPORE AGENCY FOR SCIENCE, TECHNOLOGY & RESEARCH GEORGIA TECH RESEARCH CORPORATION US20060197232A1 Published Application 2012-11-01T05:58:10Z 2012-11-01T05:58:10Z 2006-09-07 Patent TAY, ANDREW AH ONG,ANG, SIMON SAW-TEONG,LIAO, EBIN (2006-09-07). Planar microspring integrated circuit chip interconnection to next level. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/35266 NOT_IN_WOS PatSnap
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description US20060197232A1
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
TAY, ANDREW AH ONG
ANG, SIMON SAW-TEONG
LIAO, EBIN
format Patent
author TAY, ANDREW AH ONG
ANG, SIMON SAW-TEONG
LIAO, EBIN
spellingShingle TAY, ANDREW AH ONG
ANG, SIMON SAW-TEONG
LIAO, EBIN
Planar microspring integrated circuit chip interconnection to next level
author_sort TAY, ANDREW AH ONG
title Planar microspring integrated circuit chip interconnection to next level
title_short Planar microspring integrated circuit chip interconnection to next level
title_full Planar microspring integrated circuit chip interconnection to next level
title_fullStr Planar microspring integrated circuit chip interconnection to next level
title_full_unstemmed Planar microspring integrated circuit chip interconnection to next level
title_sort planar microspring integrated circuit chip interconnection to next level
publishDate 2012
url http://scholarbank.nus.edu.sg/handle/10635/35266
_version_ 1821222500466425856

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