A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
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2014
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sg-nus-scholar.10635-515492015-01-09T21:55:55Z A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures Tay, A.A.O. Ma, Y. Nakamura, T. Ong, S.H. MECHANICAL ENGINEERING MECHANICAL & PRODUCTION ENGINEERING Delamination Hygro-thermal stress Interfacial fracture mechanics Moisture Popcorn Reliability Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2 245-252 PITEF 2014-04-24T10:14:51Z 2014-04-24T10:14:51Z 2004 Conference Paper Tay, A.A.O.,Ma, Y.,Nakamura, T.,Ong, S.H. (2004). A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2 : 245-252. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/51549 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| topic |
Delamination Hygro-thermal stress Interfacial fracture mechanics Moisture Popcorn Reliability |
| spellingShingle |
Delamination Hygro-thermal stress Interfacial fracture mechanics Moisture Popcorn Reliability Tay, A.A.O. Ma, Y. Nakamura, T. Ong, S.H. A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures |
| description |
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. Ma, Y. Nakamura, T. Ong, S.H. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. Ma, Y. Nakamura, T. Ong, S.H. |
| author_sort |
Tay, A.A.O. |
| title |
A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures |
| title_short |
A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures |
| title_full |
A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures |
| title_fullStr |
A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures |
| title_full_unstemmed |
A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures |
| title_sort |
numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/51549 |
| _version_ |
1681083866486407168 |